~Low height, micro size, high-heat resistance thermistor, wire bonding dedicated line up ~
Available chip size: Wire diameter φ50~450µm
Wire bonding is available for power semiconductor, IGBT, Laser diode, LED COB.
The other types matching for soldering or conductive paste are also available.
Back side with Au type for AuSn die bonding is also available.
・Wire bonding
Ultrasonic waves (wedge bonding, ball bonding)
・Die bonding
Resin or AuSn attachment
・Wire types
Aluminum wire, Au wire (Diameter: Please refer to the chart as below.)
Chip Size | L | W | t | Electrode size | Available wire diameter |
---|---|---|---|---|---|
3216 size | 3.2±0.05 | 1.6±0.05 | 0.15±0.03 | (1.00)×(1.50) | ~450μm |
2125 size | 2.0±0.05 | 1.25±0.05 | 0.15±0.03 | (0.60)×(1.20) | ~300μm |
1608 size | 1.6±0.05 | 0.8±0.05 | 0.15±0.03 | (0.50)×(0.70) | ~200μm |
1005 size | 1.00±0.05 | 0.50±0.05 |
0.15±0.03 0.10±0.03 |
(0.25)×(0.44) | ~125μm |
0603 size | 0.60±0.05 | 0.30±0.05 | (0.20)×(0.25) | ~50μm |
・3216 size
Part Name | R25 | R25 tolerance | R25/85 | R25/85 tolerance |
---|---|---|---|---|
364FT3216A5P3 | 360kΩ | ±5% | 3370K | ±1% |
104FT3216A5P3 | 100kΩ | ±1%,±5% | ||
503FT3216A5P3 | 50.0kΩ | ±1%,±5% | ||
103FT3216A5P3 | 10.0kΩ | ±1%,±5% | ||
364FT3216B5P3 | 360kΩ | ±5% | 3435K | ±1% |
104FT3216B5P3 | 100kΩ | ±1%,±5% | ||
503FT3216B5P3 | 50.0kΩ | ±1%,±5% | ||
103FT3216B5P3 | 10.0kΩ | ±1%,±5% |
・2125 size
Part Name | R25 | R25 tolerance | R25/85 | R25/85 tolerance |
---|---|---|---|---|
364FT2125A5P3 | 360kΩ | ±5% | 3370K | ±1% |
104FT2125A5P3 | 100kΩ | ±1%,±5% | ||
503FT2125A5P3 | 50.0kΩ | ±1%,±5% | ||
103FT2125A5P3 | 10.0kΩ | ±1%,±5% | ||
364FT2125B5P3 | 360kΩ | ±5% | 3435K | ±1% |
104FT2125B5P3 | 100kΩ | ±1%,±5% | ||
503FT2125B5P3 | 50.0kΩ | ±1%,±5% | ||
103FT2125B5P3 | 10.0kΩ | ±1%,±5% |
・1608 size
Part Name | R25 | R25 tolerance | R25/85 | R25/85 tolerance |
---|---|---|---|---|
364FT1608A5P3 | 360kΩ | ±5% | 3370K | ±1% |
104FT1608A5P3 | 100kΩ | ±1%,±5% | ||
503FT1608A5P3 | 50.0kΩ | ±1%,±5% | ||
103FT1608A5P3 | 10.0kΩ | ±1%,±5% | ||
364FT1608B5P3 | 360kΩ | ±5% | 3435K | ±1% |
104FT1608B5P3 | 100kΩ | ±1%,±5% | ||
503FT1608B5P3 | 50.0kΩ | ±1%,±5% | ||
103FT1608B5P3 | 10.0kΩ | ±1%,±5% |
・1005 size
Part Name | R25 | R25 tolerance | R25/85 | R25/85 tolerance |
---|---|---|---|---|
364FT1005A5P3 | 360kΩ | ±5% | 3370K | ±1% |
104FT1005A5P3 | 100kΩ | ±1%,±5% | ||
503FT1005A5P3 | 50.0kΩ | ±1%,±5% | ||
103FT1005A5P3 | 10.0kΩ | ±1%,±5% | ||
364FT1005B5P3 | 360kΩ | ±5% | 3435K | ±1% |
104FT1005B5P3 | 100kΩ | ±1%,±5% | ||
503FT1005B5P3 | 50.0kΩ | ±1%,±5% | ||
103FT1005B5P3 | 10.0kΩ | ±1%,±5% |
・0603 size
Part Name | R25 | R25 tolerance | R25/85 | R25/85 tolerance |
---|---|---|---|---|
364FT0603A5P3 | 360kΩ | ±5% | 3370K | ±1% |
104FT0603A5P3 | 100kΩ | ±1%,±5% | ||
503FT0603A5P3 | 50.0kΩ | ±1%,±5% | ||
364FT0603B5P3 | 360kΩ | ±5% | 3435K | ±1% |
104FT0603B5P3 | 100kΩ | ±1%,±5% | ||
503FT0603B5P3 | 50.0kΩ | ±1%,±5% |
Metallization for the back surface is request basis
-40℃~250℃